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Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

By: scmp.com

Nov 16 2024
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Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

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Archegos founder Bill Hwang faces 21 years in US jail for fraud, market manipulation