![TSMC experimenting with rectangular wafers vs. round for more chips per wafer](https://img.easybranches.com/uploads/news/2024/06/14615360.jpg)
HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. is exploring a new method of advanced chip packing as the world's biggest chipmaker races to keep pace with the AI-fueled demand for computin… [+202 chars]
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