Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project

Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project
Beijing plans 12-inch wafer fab, pouring US$4.6 billion into state-backed chip project
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