TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona

Taipei, Oct. 4 (CNA) Taiwan Semiconductor Manufacturing Co. (TSMC) and U.S.-based Amkor Technology, Inc. have signed a memorandum of understanding (MOU) on collaborating to bring advanced packaging and test capabilities to Arizona, the companies said Friday.

TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona

TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona

TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona

TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona
TSMC, Amkor sign MOU to collaborate on advanced packaging in Arizona
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